Technology  Matrix
ASIC/FPGA Processors: ARM, NIOS, MICROBLAZE
RTL Design:
  1. IP: Nand, I2C, I2S, SPI, VGA.
  2. Protocols: AMBA- AHB, AXI, Avalon Bus, PLB.
Verification:

  1. Functional/gate Level SoC Verification
  2. Environment: BFM development.
Languages: Verilog, System Verilog, VHDL
FPGA: Altera, Xilinx
Hardware Platforms 8051, PIC, x86, Atmel PowerPC, Mobile Processors, xScale, DSP (Blackfin from Analog Devices & TMS from TI), MSP, ARM7 (STR711x) and ARM9 (AT91SAM9x), ST microcontrollers, System on Chip architectures, ASIC, FPGA
Operating Systems RTOS concepts, Windows CE 6.0RTX/Windows, ucLinux, Linux 2.6 Kernels, Free RTOS, ST40, ST20, Custom written schedulers, memory managers, file systems
Languages Assembly, Embedded C, C++, C#, Ada, PHP, Shell Script, Perl
Device Driver For peripherals like Ethernet Controllers on PCI, VGA, GLCD, devices connected to SPI, I2C, etc. On Linux, Windows, Windows CE 6.0, x86, ARM9 etc
MMI Tcl/Tk, VB, VC++, Graphics LCD, Alphanumeric LCD, EasyGUI, Touch Screen, HTTP, PHP, MySQL, XML
IDE Eclipse, Keil vision, Code Composer Studio, Visual Studio, Netbeans, RIDE, Quartus, Nios II, MPLAB
Telecomm/Networking Physical layer standards, Ethernet, Switching, 802.3, 802.11, Network: IP v4 IP v6, IPSEC, Transport: TCP, UDP, IPX, SPX, Application: HTTP, HTTPS, SMTP, RTP, H.323, MGCP, SIP, QoS, WAN optimization, Asterisk, IP Telephony, Real time network protocols, ZigBee
Image Processing openCV, ITK
PCB Design and Fabrication Tools: gEDA, Orcad, KiCAD, Eagle;
PCB Skills: Multi layer, high speed, impedance controlled, cross talk and signal integrity, Fine pitch BGA, multiple split power planes, library development Symbols as per IEEE & IPC-7531
PCB Fabrication: Multilayer, ENIG finish, RoHS
PCB Assembly: RoHS, BGA, Stencil Creation,
Testing: BBT, Flying Probe, Nail Bed, X-ray verification, Automated Visual Inspection