Kalycito at Embedded World, Feb 2018

4 February 2018- OSADL, Kalycito, and Fraunhofer IOSB successfully conclude Phase 1 of the “Multivendor TSN and Open Source OPC UA” program with the presentation of OPC UA Pub/Sub integrated with leading TSN silicon platforms at the OSADL booth at the Embedded World 2018 trade fair in Nuremberg, Germany