9 April 2018 – There was strong interest in our multi vendor TSN and open source OPC UA ecosystem project for Industry 4.0. This project involves the integration of TSN across multiple silicon vendor IPs, running an open source OPC UA stack on top to achieve real-time communication.
The efforts so far have achieved good performance and all the base software components used in this project are available open source for interested users to download and evaluate the solution. The next steps for this project will focus on improving the performance numbers and prototyping configuration tools required for setting up engineered networks.
Going forward, the launch of the second phase of the crowdfunded OSADL Kalycito Fraunhofer IOSB community project will continue efforts towards establishing an open source full stack OPC UA TSN distribution, as the communications backbone for Industrial IoT.