The event had 147 registrations from 20 countries also from outside Europe showing the international commitment towards OPC UA. Also for a majority of attendees, this was their first OPC Day event. Among the participants there were a big number of developers and product managers in attendance which reflected the increasing pace of adoption of OPC UA in products in the field.
Presentations at the event included progress on the machine vision and robotics information models developed by companies such as Bosch and Kuka in association with the VDMA. There was great interest in the Microsoft presentation on the Azure cloud solution and the various integration possibilities with OPC UA from the chip to the cloud.
Rockwell gave a presentation on their rationale behind joining the shapers group and how they see OPC UA TSN as the unifying technology to deliver more value to their customers. In contrast, Siemens presented on their initiatives in the LNI test bed where OPC UA TSN is considered only for M2M communication and field communication is still considered with existing Industrial Ethernet technologies such as PROFINET.