Successful launch of crowd funded project phase 2 for OPC UA TSN

 
Date: 26-Feb-2019, Nuremberg, Germany

Kalycito along with OSADL & Fraunhofer IOSB has successfully launched phase #2 of the global industry 4.0 open source crowdfunded initiative at Embedded World 2019, Nuremberg, Germany. This initiative to build an Open Source Eco-system for addressing interoperability challenges of Industry 4.0 projects by using OPC UA/TSN managed to raise 60,000 euros for this phase of the project. The funding for the project is still open and we expect the number to triple in the next few months.

Kalycito, is a partner along with Fraunhofer IOSB, a German research institute and OSADL, a German consortium of about 100 companies in this initiative. In fact, it was Kalycito who triggered the initial move by funding the phase 0 in 2017 and also brought together Fraunhofer IOSB  and OSADL.

Recalling the major announcement by several automation technology providers at SPS IPC Drives 2018 – who altogether account for more than 95 percent of the market (ABB, BECKHOFF, Bosch-Rexroth, B&R, Cisco, Hilscher, Hirschmann, Huawei, Intel, Kalycito, KUKA, Mitsubishi Electric, Molex, Omron, Phoenix Contact, Pilz, Rockwell Automation, Schneider Electric, Siemens, TTTech, Wago, Yokogawa) – that they are now in favor of a unified architecture that supports vendor independent interoperability from sensor to cloud. It is noteworthy that these companies did not opt for any of the more than 50 different field buses or real-time communication methods used so far. Instead they agreed to unite behind the standard of OPC UA PubSub via TSN.

Kalycito initiate is designed to build on top of this major global initiative by offering a Open Source Eco System that enables vendor independent, end-to-end interoperability from sensor to cloud. After the successful completion of the project phase #1, the entire work output is available as open source for download in github. Kalycito also provides quick-start guides  that can be used by industry and academia with rich generic features ready to be combined with a proprietary technology and application to deliver bleeding edge products and services to customers. While a very affordable total cost of ownership is a key differentiator of this joint initiative, the market demands feature completeness, stability and certified adherence to the standards and the Phase 2 aims to achieve that.

(Dr. Carsten Emde, Chairman of OSADL launching the phase 2 of the project at Embedded World, Nuremberg, Germany) (Siddharth, Kalycito presenting the project status in a conference session at the Embedded World, Germany 2019)